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Ceramic Substrate Ceramic substrate is a substrate embed with material like alumina, aluminum nitride, boron nitride, and silicon nitride. Ceramic substrates have been applied in electronic components for decades from electronic integrated circuits to power modules. The ceramic substrate has multiple functions. Combining properties of mechanical strength and thermal management, and electrical isolation. The superior structural integrity, insulation electric properties, and heat […]

What Is Chip on Board LED? What is cob? Chip on board can heat dissipation when embed on substrate of high powered LED die. This cob technology is able to connect unpackaged circuit board to ceramic PCB , realizing a highly miniaturized design for manufacturing and assembly. It has become commonly in MCM application. Typically, the absence of first-level packaging

Thermal Management in Electronics: A Complete Guide to Heat Dissipation and Reliability What is Thermal management? Thermal management is a technology to realize low temperature control that close to typically environmental temperature. The improvement of machine performance and reliability are decided by thermal management of electronics. It is proved that the lifespan of a motor generally decreases

Screen Printing Of Ceramic Substrate Screen printing is a way to produce a desire pattern that material deposition onto a surface by forcing ink via a fine mesh screen. It is suitable for printing on different types of surfaces. In screen printing equipment, ink is spread across a patterned mask using a screen print squeegee and transferred onto the substrate

TL;DR:A heat sink is a passive cooling component used in electronics to dissipate heat and maintain safe operating temperatures. It works by transferring heat away from devices (like chips or power modules) into the surrounding air through conduction and convection. Effective heat sink performance depends on smart design choices—such as surface area, fin structure, airflow,

How to choose ceramic PCB copper thickness? Copper thickness is typically embedded within ceramic substrates used in AI chips, aerospace electronics, and EV power modules, functioning as electrical resistors, ceramic capacitors, and inductors to manage impedance and signal integrity, The copper layer thickness — often ranging from 0.25 oz to 5 oz — depends on