Your questions answered
Common questions
How long will it take to ship my order?
The estimated delivery time will be provided along with the quotation.
What payment methods do you accept?
Currently, we only accept bank transfers
Can I get refund?
Yes, returns are accepted for standard products such as bare substrates and metallized substrates. If you are not satisfied with the product you purchased, you can return it, provided the product arrives at our warehouse in its original packaging and in good condition.
What surface finish options are available?
| Application | Recommended Finish |
|---|---|
| High-frequency, high-speed signals | Immersion Silver, ENEPIG |
| High-power devices | Gold or Silver Plating (high conductivity) |
| LED lighting | Gold or ENIG (good reflectivity) |
| Multiple soldering/storage | ENIG, ENEPIG |
| OSP (anti-oxidation) |
What temperatures can high-temperature solder masks withstand?
Inorganic Ceramic Solder Mask
Temperature Resistance: Up to 500°C or higher
Composition: Glass powder, oxides, silicates, etc.
Features:
Extremely high thermal stability and chemical inertness
Ideal for high-power devices and high-temperature environments
Matches well with ceramic substrates (similar CTE)
Applications: Power modules, LED packaging, automotive electronics
Polyimide (PI) Organic Solder Mask
Temperature Resistance: 250–300°C long-term, up to 350°C short-term
Features:
Excellent flexibility, suitable for flexible circuits
Strong chemical resistance
Ideal for high-density packaging and high-temperature environments
Applications: Aerospace, automotive electronics, flexible PCBs
What is the aspect ratio of ceramic PCB holes?
The aspect ratio of a ceramic PCB is the ratio of board thickness to the smallest laser-drilled hole diameter on the same board. Thickness refers to the physical size before copper plating, soldering, or solder mask application. The higher the aspect ratio, the more difficult the plating process.
Our standard aspect ratio is 6:1. For example, if the board thickness is 1.0 mm, the hole diameter must be ≥0.16 mm.




