Your questions answered

Common questions

The estimated delivery time will be provided along with the quotation.

Currently, we only accept bank transfers

Yes, returns are accepted for standard products such as bare substrates and metallized substrates. If you are not satisfied with the product you purchased, you can return it, provided the product arrives at our warehouse in its original packaging and in good condition.

ApplicationRecommended Finish
High-frequency, high-speed signalsImmersion Silver, ENEPIG
High-power devicesGold or Silver Plating (high conductivity)
LED lightingGold or ENIG (good reflectivity)
Multiple soldering/storageENIG, ENEPIG
 OSP (anti-oxidation)

Inorganic Ceramic Solder Mask

  • Temperature Resistance: Up to 500°C or higher

  • Composition: Glass powder, oxides, silicates, etc.

  • Features:

    • Extremely high thermal stability and chemical inertness

    • Ideal for high-power devices and high-temperature environments

    • Matches well with ceramic substrates (similar CTE)

    • Applications: Power modules, LED packaging, automotive electronics

Polyimide (PI) Organic Solder Mask

  • Temperature Resistance: 250–300°C long-term, up to 350°C short-term

  • Features:

    • Excellent flexibility, suitable for flexible circuits

    • Strong chemical resistance

    • Ideal for high-density packaging and high-temperature environments

    • Applications: Aerospace, automotive electronics, flexible PCBs

The aspect ratio of a ceramic PCB is the ratio of board thickness to the smallest laser-drilled hole diameter on the same board. Thickness refers to the physical size before copper plating, soldering, or solder mask application. The higher the aspect ratio, the more difficult the plating process.

Our standard aspect ratio is 6:1. For example, if the board thickness is 1.0 mm, the hole diameter must be ≥0.16 mm.