fabrication method

AMB Substrate Material: Why Active Metal Brazing Matters Active metal brazing is a jointing method to combine ceramics and metal. Filler metals or alloys are required to achieve strong bonded interfacing with the base material to reduce the cost. The common ways includes adhesives,brazing and attachment. Different from mechanical connections and adhesives, brazing is appropriate for control module power […]

Thermal and Electrical Performance of DBC Substrate: Key Considerations What is DBC substrate? DBC(Direct bond copper) is one of promising method in integrated power module, like EV , AI chips, and aerospace electronics. Which forms hundreds of micrometers to produce copper layers in DBC technology. This process has high cost effective in mass production. In Direct Bond

TL;DR：Surface tension in ceramic PCBs refers to the surface energy that governs how well liquids (like solder, inks, or coatings) spread and adhere to the substrate. It is critical for ensuring good wettability, strong adhesion, and reliable metallization. Surface tension is influenced by factors such as material composition, surface cleanliness, and roughness. It is typically

How to Choose a Reliable Ceramic printed circuit board Manufacturer Ceramic substrates market continually occupied vital position in semiconductor production equipment, driven by key sectors such as aerospace technology, cars electronics and chips design. It is predicted that the market share will reach USD 250.30 billion by 2032, with Annual Growth Rate (CAGR) of 10.1%. However,  how

TL;DR: Thermal stress in ceramic substrates happens when materials expand or contract unevenly due to high temperatures, common in power electronics. Major consequences include cracking of the ceramic and delamination at ceramic–metal interfaces, which can reduce reliability and performance. Main causes are elevated operating temperatures, mismatched thermal expansion between materials, and rapid temperature changes. To

What Is Copper Oxide? Properties, Types, and Engineering Applications Introduction When copper is exposed to air, oxidation occurs in the presence of oxygen, especially at elevated temperatures. The resulting oxidation states are governed by thermodynamic stability. In certain conditions, a multilayer insulation structure dominated by a Cu₂O scale can develop. As the oxidized layer thickness,

why AI chips need advance cooling? Introduction Artificial intelligence chip refer to a new generation of microprocessors designed to efficiently accelerate AI task manager while reducing data center energy consumption. As their high density computing continues to increase, traditional cooling methods are no longer sufficient, making integrated thermal management essential. These solutions combine advances in materials with system-level optimization. Currently, AI chips play a critical

How to weld aluminum？ Different from cutting technology,  in welding, piece of metal is heated and then pressed or hammered together, squeezing out oxides and slag so that a strong bond forms between the surfaces. In fusion welding, Be care of melting and melting point,  jointing the border of two metal sheet. Methods of welding

Does gold electroplate tarnish? Introduction The annual gold consumption of technology up to 326t in 2024. which implies high speed development of semiconductor production. On the other hand, electronic industry as a core of it require special connecting electronics. It also proved the importance of gold electroplating technique meet the demands of appliances electrical electronics

Factors Affecting Alumina Density Measurements Alumina Powder Alumina, also known as aluminum oxide (Al2O3), is a versatile material widely used in various industries. Its properties, such as hardness, strength, and thermal conductivity, make it a valuable component in applications ranging from ceramics to electronics. One critical aspect of working with alumina is understanding its density,