Alumina Ceramic Substrate

Engineered for High-Power Applications

Alumina substrates (Al₂O₃ ceramic substrates) are widely used in electronic and power semiconductor applications because of their excellent electrical insulation, mechanical strength, and thermal stability. Compared with conventional PCB materials, alumina substrates provide more reliable performance in high-temperature and high-power environments. Manufactured through precision ceramic sintering processes, alumina substrates offer stable dimensions and consistent quality. They are available in various thicknesses and sizes to meet different electronic design requirements. Thanks to their strong dielectric properties and good thermal conductivity, aln substrate is commonly used as insulating bases for electronic circuits and devices. Typical applications include LED packaging substrates, power modules, hybrid circuits, automotive electronics, sensors, and semiconductor packaging. With high dielectric strength, and excellent resistance to heat, corrosion, and wear, alumina substrates provide reliable thermal management and long-term stability for demanding industrial and electronic applications

Typical thermal conductivity: 20–30 W/m·K
Typical copper thickness: 18–300 µm
Available processes: DPC / DBC / AMB

Comparison of Ceramic Substrate Metallization Processes

Process	Copper Thickness	Pattern Accuracy	Typical Applications
DPC	5 – 300 µm	High	LED Packaging, Laser Diodes
DBC	150 – 600 µm	Medium	IGBT Modules, Power Electronics
AMB	200 – 1000 µm	High	High-Power Modules, Automotive Electronics