This single-layer ceramic PCB is manufactured using the DPC (Direct Plated Copper) process and utilizes high-quality alumina (Al₂O₃) as the substrate material. With a board thickness of 0.635 mm (25 mils), it provides outstanding mechanical strength, dimensional stability, and thermal reliability, making it suitable for a wide range of high-demand electronic applications.
The circuit layer is composed of 35 μm (1.4 mil / ≈1 oz) thick copper, offering stable current-carrying performance and fine circuit patterning. The surface is finished with a generous layer of 1.3 μm (≈51.2 μin) gold plating, providing exceptional corrosion resistance, long-term aging durability, and excellent solderability for both SMT and wire bonding applications.
Thanks to the DPC technology, the copper adheres strongly to the ceramic base, enabling precise pattern formation with high adhesion reliability. With a compact footprint of 21.48 mm × 21.48 mm(846 mil × 846 mil), this board is perfect for infrared detector that demand high thermal and electrical performance.
