This product is a high-performance ceramic copper-clad board manufactured using the Active Metal Brazing (AMB) process on Aluminum Nitride (AlN) ceramic. The board features double-side polished copper surfaces, ensuring excellent electrical conductivity and surface smoothness.
It consists of a 2-layer structure with a total thickness of 0.635 mm (25 mil) and 200 μm (7.87 mil / approx. 5.9 oz) thick copper on each side, making it ideal for high current applications.
With precise dimensions of 40.95 mm × 21.4 mm (≈1613 mil × 843 mil), this board is highly suitable for compact electronic modules that demand efficient heat dissipation, electrical insulation, and mechanical reliability.
