This high-reliability power ceramic board is manufactured using Direct Plated Copper (DPC) technology on a 2.16 mm (85 mil) thick Alumina (Al₂O₃) ceramic substrate. Engineered for embedded resistor power supply modules, the board supports compact layouts and long-term electrical stability under high load conditions.
The board features a 100 μm (3.94 mil / ~2.94 oz/ft²) thick copper layer, providing solid current-carrying performance and efficient thermal dissipation. The copper is plated with a 2 μm (78.74 μin) Nickel layer and 0.05 μm (1.97 μin) Gold layer, ensuring excellent solderability, oxidation resistance, and durable interconnection.
