This product is a high-performance ceramic substrate manufactured using advanced HTCC (High-Temperature Co-Fired Ceramic) technology—one of the leading solutions in China for high-reliability electronic packaging.
Constructed from high-purity Aluminum Oxide (Al₂O₃), the substrate offers excellent thermal conductivity, high insulation resistance, and long-term reliability. Its structure features precisely controlled cavities and embedded tungsten (W) circuits, providing robust mechanical and electrical integration for demanding environments.
The surface is coated with 0.5 μm (≈19.7 μin) thick gold plating, significantly enhancing wire bonding strength and resistance to degradation, ensuring compatibility with fine-pitch die attach and interconnect technologies.
