what is ev? Are electric cars better for the environment?
In 2024, the global market sales of new energy vehicles breakthrough 17 million. over past years, car sales in China exceed two third globally. In U.S, there are 1.6 million sales in 2025. It is predicted that other regions of world will increase 30% [1]. In the revolution of new clean energy, NEVs (green vehicles) has attracted government attention, they posted a number of measure preferential benefits to allure purchasing intention. As an effective way to alleviate air pollution and better for environment. Semiconductor power modules are essential parts of clean energy vehicles in electrified vehicles. However, running high current, and elevated temperature demands on thermal management and electrical insulation. This is where ceramic substrates come into play. This essay will emphasis on key module of EVs, which contain ceramic PCB to improve environment.
Vehicle Control Unit
The Structure Of Vehicle Control Unit
Vehicle Control Unit(VCU) is an embedded computer, which consists of central control, in charge of the subsider system of a car. An intelligent power module is combined with the injector to form a single assembly unit.
The Function Of Electronic Module
The electronic module is equip with function of data collection, a computing unit and a sensor in an electronic memory. It is inserted with an efficient IGBT module to realize reliability and high power density for long term use(high efficiency). The robust IGBT assembly is compatible for electric vehicle integration [2].
IGBT Modules for Electric Vehicles
Voltage rating: 400–600 V, supporting robust performance under severe automotive environmental stresses [3].
Integration: well-suited for electric vehicle (EV) systems, ensuring power efficiency and stability.
Limitation: higher thermal stress management challenges at elevated temperatures.
Transition to SiC Technology
With increasing power and density demands, Silicon Carbide (SiC) emerges as a replacement for IGBT:
Temperature capability: withstands up to 250 °C, higher than traditional IGBT.
Electrical performance:
At 15 MHz: only 4.4 nH inductance and 2 mΩ resistance between p-terminal and n-electrode.
Enables lower heat loss and enhanced switching efficiency.
SiC MOSFET advantages: superior surge current tolerance and higher reliability in high-frequency, high-performance applications
| Company | Device Type | Application Scenario | Technical Document / Link |
|---|---|---|---|
| Infineon | SiC MOSFET | EV charging stations, improved charging efficiency | CoolSiC™ MOSFET for fast charging |
| ON Semiconductor | SiC MOSFET | High-voltage power supplies, railway traction, welding machines, lasers | SiC MOSFET Gate Drive Optimization |
| STMicroelectronics | IGBT | Industrial inverters, power tools, HVAC, UPS, welding, solar inverters | IGBT product overview |
| Texas Instruments | SiC | EV onboard chargers | Gate Driver Solution |
| Mitsubishi Electric | MOSFET | Solar applications | for EV Chargers using SiC MOSFETs (PDF) |
| Mitsubishi Electric | SiC MOSFET | Electric train traction inverters, full SiC power modules, industrial applications | Full-SiC Power Module NX Type Application Note (PDF) |
| Mitsubishi Electric | IGBT | Electric train traction inverters, welding equipment | Traction Inverter Systems with SiC Modules (PDF) |
| Tesla, Inc | SiC | Model Y Kyocera AlN substrate | Tesla SiC Inverter Teardown by Yole Group |
On board charging
On board charging(OBC) is a power components, transferring ac to dc converter, providing energy for vehicle’s battery pack. Due to it accessibility, high-cost and large capacity solution are far more beyond off-board charging method.
Heat Dissipation Challenges
Currently, about effect of heat dissipation, To dissipate heat generated by electronic components,
OBC operation generates significant heat, which requires efficient thermal management:
Aluminum-based heat sink enclosures are widely used.
ADC12 aluminum and alumina alloys provide:
Low weight and high reliability.
Good thermal conductivity.
Effective thermal transfer from electronic components to the ambient environment through through-plane conduction.[4].
Thermal Expansion Mismatch
One of the primary challenges in OBC design is the mismatch between copper and semiconductor materials during chip attachment and device operation:
Copper (Cu): ~17 ppm/K.
Semiconductors (Si, SiC, GaN): ~3–5 ppm/K.
This mismatch leads to mechanical stress and reliability issues under thermal cycling [5].Metal Ceramic Substrate (MCS) Solutions
Metal Ceramic Substrates (MCS) provide a structural solution by stacking layers:
Top and bottom: copper.
Middle: ceramic substrate.
Functions of the ceramic intermediate layer:
Constrains the high thermal expansion of copper.
Provides electrical insulation between power-carrying and grounded copper layers.
Maintains sufficient thermal conductivity for effective heat dissipation.
Charging station
The merit of EV Car Charger Station
The emerging of ev power vehicles push people to use electric vehicle supply equipment (EVSE). Compared with traditional fuel Internal Combustion Engine (ICE), electric powered vehicles(EV) charging need to perform advanced power level for ultra-fast charging.
Materials Applied In Car Charger Station
SiC MOSFETs with better voltage capacity( voltage ratings) of 3.3 kV and decrease the energy losses when switching [6]. When operating higher voltage, silicon carbide power modules reveal better charging speed. If operate low frequency levels,SiC power modules enable improved charging efficiency, making them particularly well suited for EV battery systems that require fast charging and high power density. which will occupied electric vehicles power converters market. The voltage rage of SiC from 650V to 1700V, designing for 1200 V applications are available in a wide range of current ratings, typically spanning from 2 A up to 90 A, supporting a growing number of high-power electronic devices [7]
LIDAR
Vertical-Cavity Surface-Emitting Lasers (VCSELs) are widely used as LIDAR light sources due to their:
High reliability organization
Reduced cost of goods manufactured.
Compatibility with ceramic substrates.
Aluminum Nitride (AlN) Substrate Design
To integrate VCSELs effectively, aluminum nitride (AlN) substrates are employed:
Layout creation involves via drilling through the full thickness of the AlN substrate.
Key properties of AlN:
Thermal conductivity: 320 W/m·K.
Coefficient of thermal expansion (CTE): 4.4 × 10⁻⁶/°C [8].
These properties make AlN highly suitable for high-performance optoelectronic devices.
Benefits for Next-Generation LIDAR Systems
The combination of VCSEL technology with AlN substrates enables:
Compact and lightweight LIDAR systems.
Enhanced thermal efficiency for heat management.
Cost-effective solutions for next-generation autonomous vehicles.
Conclusion
This essay highlights three critical components in EV modules: on-board charging systems, charging stations, and LiDAR technologies — all of which are closely tied to the use of advanced ceramic substrates. Materials like Silicon Carbide (SiC), VCSELs (Vertical-Cavity Surface-Emitting Lasers), and Aluminum Nitride (AlN) have made significant contributions to improving the efficiency, thermal management, and performance of EV modules. With their exceptional electrical, thermal, and mechanical properties, these materials continue to attract growing attention in the automotive and EVs industries. As the EV market evolves, the role of ceramic substrates and their associated cutting and processing technologies will become even more vital in shaping the next generation of high-performance, reliable electric vehicles.
