DPC Al₂O₃ – 28.57 oz Thickness – Controlled Depth Groove 8.57 oz

DPC Al₂O₃ – 28.57 oz Thickness – Controlled Depth Groove 8.57 oz – Metal Semi-via Process

Manufacturing Process: DPC (Direct Plated Copper)
Substrate Material: High-purity Alumina (Al₂O₃), vacuum grade
Substrate Thickness:28.57 oz(100 mm)
Cavity Depth: 1181 mil (30 mm / 300 μm)
Via Type: Metallized half-through holes
Application: Micro-pressure sensor packaging
Advantages:
- High mechanical strength
- Reliable electrical connections
- Enhanced cavity precision for better sensor response

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This micro-pressure sensor substrate is manufactured using the Direct Plated Copper (DPC) process on a high-purity vacuum-grade Alumina (Al₂O₃) ceramic with a thickness of 28.57 oz (39.37 mil) . The cavity is precisely etched to a depth of 1181 mil (8.57 oz / 300 μm), optimizing sensor sensitivity and performance.

The design incorporates metallized half-through holes, providing reliable electrical interconnection and enhanced mechanical robustness, making it an ideal solution for precision micro-pressure sensor applications.