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GEN-DPC-ALN-T19.7mil-Cu1oz-NiPd157μ”

  • Substrate: High-purity Alumina (Al₂O₃)
    Structure: Single-layer DPC
    Substrate Thickness: 0.5 mm (0.0197 inch)
    Copper Thickness: 35 μm (≈1.38 mil)
    Nickel Plating: 4 μm (≈157 μin)
    Advantages: High thermal conductivity, excellent electrical insulation, superior solderability
    Applications: Thermoelectric modules, LED drivers, power IC packaging, compact heat dissipation devices

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High-Performance DPC Alumina Ceramic PCB for Thermal Management Applications

This high-performance Direct Plated Copper (DPC) alumina ceramic printed circuit board is designed for applications that demand excellent thermal management and electrical performance.

It features a single-layer structure built on a 0.5 mm (19.685 mil / 0.0197 inch) thick high-purity alumina (Al₂O₃) substrate, offering high thermal conductivity and outstanding electrical insulation.

The PCB is equipped with a 35 μm (≈1.38 mil) copper layer and a 4 μm (≈157 μin) thick nickel plating, providing enhanced aging resistance, oxidation resistance, and excellent solderability.