This is a high-performance alumina (Al₂O₃) ceramic substrate manufactured using the Direct Plated Copper (DPC) process. With a board thickness of 40 mil (approximately 1.016 mm) and a 1 oz/ft² copper layer (equivalent to 35 μm), it provides excellent thermal conductivity and electrical insulation.
The substrate features copper-filled via holes, enabling robust vertical electrical interconnection and enhanced current-carrying capability. The surface is gold-plated without nickel (ENIG-free), with a gold thickness of 52 microinches (≈1.32 μm), which ensures superior wire bonding performance and oxidation resistance in demanding environments.
This structure is ideal for power modules, sensor packages, or thermoelectric applications requiring long-term stability, clean surfaces, and high current handling.
