This high-performance ceramic PCB adopts the Direct Bonded Copper (DBC) process on 96% Alumina (Al₂O₃) substrate, offering excellent thermal performance and mechanical reliability. With a 2-layer structure and a board thickness of 0.38 mm (≈14.96 mil), it is well-suited for compact power applications.
The outer copper layer is 35 μm (1.38 mil, approx. 1 oz/ft²), ensuring stable current handling. The ENIG (Electroless Nickel Immersion Gold) surface finish provides outstanding corrosion resistance and bondability, with gold thickness ≥3 μm (≥118 microinch). The minimum hole diameter is 0.8 mm, compatible with standard through-hole components.
The ceramic insulation layer offers a high thermal conductivity of 30 W/m·K, ideal for laster devices requiring efficient heat dissipation and electrical insulation.
