This IGBT module substrate is specially designed for photovoltaic inverter applications. Manufactured using Direct Bonded Copper (DBC) technology on Alumina (Al₂O₃) ceramic, it provides a high-reliability solution with excellent thermal and electrical performance.
The substrate features 8.5oz thick copper for superior current handling and thermal conductivity. With a minimum line width of 40 mil and a minimum spacing of 20 mil, it supports high-density circuit layouts while maintaining electrical insulation. The copper layer is plated with 120 μ” of Nickel and 2 μ” of Gold, ensuring excellent bondability and resistance to corrosion and oxidation.
It also provides a dielectric withstand voltage of up to 5000V, making it ideal for high-voltage environments such as solar inverters and energy storage systems.
