This VCSEL (Vertical-Cavity Surface-Emitting Laser) substrate is manufactured using Direct Plated Copper (DPC) technology on alumina (Al₂O₃) ceramic, delivering high thermal stability, precise circuit definition, and excellent optical reflectivity—ideal for VCSEL chip packaging, optical communication, and laser module applications.
The board features copper-filled vias, providing superior vertical heat dissipation and enhanced electrical connectivity, even in compact or high-density designs. A white solder mask is applied for optimal reflectivity in optical paths, improving light output efficiency and minimizing optical loss.
The substrate is constructed with a 65 μm (1.8 oz/ft²) thick copper layer, ensuring reliable current carrying capability. It supports minimum via diameters as small as 0.1 mm (4 mil), enabling high-density interconnection and micro-scale device integration.
