IGBT-DBC-ALN-Cu 8.5 oz-LS 40 mil-LW 20mil

This Alumina IGBT ceramic substrate is manufactured using DBC (Direct Bonded Copper) technology, providing excellent thermal conductivity and mechanical strength. With a copper layer thickness of 300 μm (8.5 oz), it is ideal for high-power applications such as IGBT modules. The substrate features a green solder mask for reliable insulation and protection, along with 0.05 μm (2 μ”) gold plating to enhance wire bonding performance and surface durability. Designed with a minimum line width of 1.0 mm and a minimum spacing of 0.5 mm, it ensures consistent electrical performance for precision power electronics.