This TEC (Thermoelectric Cooler) ceramic substrate utilizes advanced DPC (Direct Plated Copper) technology on a high-purity 0.2 mm (7.87 mil) aluminum nitride (AlN) base, offering excellent thermal conductivity and electrical insulation.
A 20 μm (0.79 mil / 0.57 oz/ft²) thick copper layer is uniformly deposited, followed by:
a nickel barrier layer of 3 μm (118.1 μinch),
a palladium layer of 0.1 μm (3.94 μinch), and
a gold surface finish of 0.17 μm (6.69 μinch),
ensuring superior wire bonding reliability and corrosion resistance.
With a minimum line spacing of 0.07 mm (2.76 mil) and an overall board thickness of 0.22 ± 0.01 mm (8.66 ± 0.39 mil), this substrate is ideal for compact and high-density TEC applications requiring precise thermal management and long-term performance stability.
