This multilayer thermoelectric cooler (TEC) baseplate is fabricated using Direct Plated Copper (DPC) technology on a high-purity Aluminum Nitride (AlN) ceramic substrate. With a total of 2 conductive layers and a substrate thickness of 0.2 mm (7.87 mil), it is specially engineered for microelectronic applications requiring fine patterning and high-reliability bonding.
The board features a 20 μm (0.79 mil / ~0.59 oz/ft²) thick copper layer for electrical conduction and thermal performance. The copper surface is sequentially plated with Nickel (3 μm = 118.11 μin), Titanium (0.1 μm = 3.94 μin), and Gold (0.17 μm = 6.69 μin), ensuring exceptional corrosion resistance, solderability, and precision bonding compatibility with sensitive components.
