This high-performance ceramic substrate is optimized for compact thermoelectric cooling (TEC) applications that demand superior thermal conductivity and reliable surface finish. Built on a high-thermal-conductivity ceramic base, the substrate features a 0.5 mm (19.69 mil) thickness, offering mechanical stability in space-constrained environments.
A 35 μm (1.38 mil / ~1 oz/ft²) copper layer is used to enable efficient heat transfer and electrical conduction. To ensure exceptional wire bonding performance and long-term corrosion resistance, the copper is coated with 0.2 μm (7.87 μin) thick gold plating, making it well-suited for precision bonding and long-lifetime operation.
